Tailored PCB engineering and heavy-duty computing components built to meet strict European standards.
Designed for smart power bank systems and IoT infrastructure across Greek industrial sectors.
Reliable DDR3 legacy RAM for retrofitted telemetry and shipping terminal computers.
High-performance edge controller motherboard supporting advanced computing configurations.
Industrial-grade DDR4 SODIMM modules offering broad compatibility with mobile workstations.
Greece is experiencing a major technological shift. Supported by the European Union's structural funds and the National Recovery and Resilience Plan ("Greece 2.0"), local industries are modernizing their infrastructures. From the busy shipping terminals in Piraeus to emerging technology parks in Thessaloniki and the massive solar farms in Central Greece, demand for reliable electronic components is growing fast.
Modern industrial systems depend heavily on Multi-layer Printed Circuit Boards (PCBs). Unlike simple single-sided designs, multi-layer PCBs (typically 4 to 32+ layers) offer the electrical performance, signal shielding, and compact design needed for advanced electronics. Whether they are managing power flow in a high-efficiency solar inverter or processing raw data in maritime tracking systems, these complex boards serve as the foundation of modern hardware.
Greece is dynamic in expanding its wind and solar power systems. Modern grid-tie inverters require multi-layer PCBs with thick copper layers (up to 4oz or more) to handle high currents and dissipate heat effectively without signal disruption.
Ports like Piraeus use automated sorting, tracking, and IoT-based logistics. These systems run constantly in harsh marine environments, making high-quality, corrosion-resistant surface finishes like Electroless Nickel Immersion Gold (ENIG) essential.
To serve Greek electronic designers and original equipment manufacturers (OEMs), our production line conforms strictly to international IPC Class 2 and Class 3 guidelines. Below is an overview of our technical capabilities:
| Parameters / Capabilities | Standard Specification | High-Precision Specification |
|---|---|---|
| Layer Count | 2 - 12 Layers | 14 - 32+ Layers (HDI available) |
| Base Materials | Standard FR4 (Tg 130-140) | High Tg FR4 (Tg 170-180), Rogers, Polyimide |
| Minimum Trace Width / Spacing | 0.1mm (4mil) | 0.075mm (3mil) |
| Board Thickness | 0.4mm - 2.4mm | 0.2mm - 6.0mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishes | HASL Lead-Free, OSP | ENIG, Immersion Silver, Hard Gold Plating |
| Blind / Buried Vias | Not Supported | Laser drilled (1+N+1, 2+N+2 stackups) |
| Copper Weight (Inner/Outer layer) | 1 oz - 2 oz | 3 oz - 6 oz (Heavy Copper for Power circuits) |
Our engineers will assist you in refining layer stack-ups, choosing thermal substrates, and running signal integrity checks to optimize production yield.
Send Inquiry NowHigh-speed server memory and multi-port motherboards configured to run demanding industrial applications.
Premium desktop RAM engineered to support high-performance data processing stations.
Designed for modern Intel processors, suitable for edge servers and monitoring systems.
DDR4 high-speed server RAM modules built for continuous 24/7 industrial datacenters.
Versatile desktop RAM modules available in multiple frequencies for standard office and lab systems.
We understand the requirements of importing electronics into the European Union. Our manufacturing processes are designed to meet all standard environmental and safety regulations, helping you keep your projects on track:
All our printed circuit boards and memory modules use lead-free materials and process options. They comply with RoHS (Restriction of Hazardous Substances) and REACH directives to ensure trouble-free customs clearance and safe operation within Greece.
Electronics are sensitive to moisture and static. We pack every order using ESD-shielding bags and moisture barrier bags with desiccant, protected by thick, shock-absorbing outer cartons to prevent damage during transport.
We coordinate with air freight forwarders to ship directly to Athens International Airport (ATH) for fast delivery, or via sea freight to the Port of Piraeus for larger, cost-sensitive production runs.
Founded in 2017, Memvora Electronics Technology Co., Ltd. is a professional manufacturer specializing in high-performance DDR5 memory modules, dedicated to delivering reliable memory solutions for consumer, industrial, enterprise, and embedded applications worldwide. With a modern manufacturing facility covering 386㎡, we combine advanced production equipment, strict quality management, and experienced engineering expertise to provide stable, high-speed memory products for global OEM and ODM partners.
Since entering the international market, Memvora has accumulated 7 years of export experience, serving customers across North America, Europe, Southeast Asia, the Middle East, and South America. Our annual export revenue exceeds US$18.6 million, supported by a strong global supply chain and long-term partnerships with more than 1,280 component suppliers and business partners.
With 14 years of industry experience, our team continuously invests in technology innovation and product development. Our R&D department consists of 126 professional engineers who focus on developing next-generation DDR5 memory solutions with higher speed, lower latency, and enhanced reliability. Last year alone, we successfully launched 86 new memory products to meet the evolving needs of gaming, AI computing, industrial automation, and enterprise servers.
Every single product undergoes 100% functional testing, burn-in testing, compatibility testing, signal integrity testing, and aging tests before shipment. Our dedicated quality control team of 42 inspectors ensures every memory module meets rigorous international quality standards and delivers long-term stable performance.
Examine our standard inventory modules and assembly configurations ready for custom private-label orders.
Original chip DDR4 laptop RAM modules featuring stable clock speeds and low thermal profiles.
High-speed DDR4 memory for workstations processing intensive database or compilation tasks.
Optimized CL22 memory kits, useful for local business desktop upgrades and system integrations.
Complete Turnkey SMT/DIP PCB assembly services tailored for industrial instrumentation and power grids.
Stable micro-ATX H81 motherboard ideal for office computing systems and local terminal units.
Dual-purpose desktop/server memory modules offering wide compatibility and high transfer rates.
DDR4 RAM modules compatible with major motherboard brands, suitable for office hardware refits.
High-density 16GB desktop memory modules designed to handle demanding multi-tasking workloads.
As technologies like 5G infrastructure, edge computing, smart grids, and automation advance in Greece, we are updating our PCB and memory manufacturing systems to support new hardware designs:
We are refining our laser micro-via processes to produce more compact multilayer stackups. This supports smaller, lightweight designs for wearable health monitors, maritime tracking devices, and drone electronics used in Hellenic agricultural projects.
Electronics operating in Mediterranean environments face high summer temperatures. We are developing boards using high-conductivity metal cores (aluminum and copper substrates) and high-Tg materials to ensure stable performance under warm conditions.
We are shifting our assembly lines toward DDR5 memory modules. These modules offer wider bandwidths and lower power consumption, matching the requirements of next-generation edge servers and AI processing setups in Greece.
Find answers to technical and logistical questions about sourcing multi-layer PCBs and memory modules from our factory.
Send us your Gerber files, bills of materials (BOM), or memory specifications. Our engineering and sales team will review your project requirements and provide a quote within 24 hours.
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Memvora